News

Rowhammer Attacks on GPU Memories are Practical” was published by researchers at University of Toronto. Abstract: “Rowhammer ...
Ferguson: This is a big part of what’s driving consolidation within the EDA industry. You see Siemens and Mentor and Altair ...
Smaller models and accelerated compute are transforming AI at the edge.
A platform-based approach to multiphysics simulation that gives engineering teams the tools to design, verify, and optimize ...
EDA and silicon IP revenue grew 12.8% in Q1 2025, totaling $5.098 billion compared to $4.522 billion in the same period last ...
A new technical paper titled “Volatile and non-volatile nano-electromechanical switches fabricated in a CMOS-compatible silicon-on-insulator foundry process” was published by researchers at KTH Royal ...
Even worse, chips and systems are now so complex that it may require a unique sequence of operations to trigger a silent data error, and they may only show up occasionally, and maybe only after months ...
A new technical paper titled “Thermal Issues Related to Hybrid Bonding of 3D-Stacked High Bandwidth Memory: A Comprehensive Review” was published by researchers at Chungbuk National University.
Intent and integrity in signoff; LPDDR in data centers; PCB stackup materials; what's new in MIPI; analog challenges.
The latest advancements in these specifications and their potential to change vision and imaging technologies.
An overview of the MRDIMM technology as a solution to memory bandwidth and capacity challenges.
Cognichip’s approach is to develop a physics-informed foundation model that achieves more parallelism than is available in ...