Abstract: Heterogeneous integration is an efficiency way to integrate III-V laser diode on the silicon-based photonics integration circuit. To provide the III-V laser diode flip-chip bonding solution ...
Dimensions (mm) 71.90 x 165.20 x 6.90 171.70 x 78.50 x 9.65 ...
Dimensions (mm) 157.12 x 74.03 x 7.95 170.00 x 75.50 x 7.00 ...
This time around, we’re comparing Samsung’s best “clamshell-like” phone with Apple’s compact “Pro” flagship phone from last year. We’re talking about the Samsung Galaxy Z Flip 7 and the Apple iPhone ...
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Flip a chair upside down for this genius porch idea!
Upcycle an old chair with a creative twist by weaving belts into the seat. This unique DIY adds texture, style, and durability to your furniture makeover. Woman knocks man from wheelchair, douses him ...
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