(25:32 + Q&A) Dr. Anne Jourdain, imecFrom the First IEEE Hybrid Bonding Symposium Summary: Hybrid bonding is recognized as the key technology for advanced heterogeneous wafer-level system integration.

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This year’s event theme, “6G—From Vision to Action,” casts light on a wide array of 6G topics, including the role of AI/ML, new mid-band spectrum and its ability to support new services, Integration ...

The candidates, Vickie Ozburn and Simay Akar Koehler, shared their vision for IEEE WIE. They have been nominated by the IEEE Women in Engineering for IEEE Women in Engineering Committee Chair-Elect, ...

(38:48 + Q&A) Masoud Babaie, Associate Professor, Delft University of Technology -- Presentation from 2023 Workshop on Quantum Computing: Devices, Cryogenic Electronics and Packaging (QC-DCEP) ...

(18:56 + Q&A) Dr. M. Fernando Gonzalez-Zalba, Quantum Motion Technologies -- Presentation from 2023 Workshop on Quantum Computing: Devices, Cryogenic Electronics and Packaging (QC-DCEP) ... Summary: ...

Celebrate the Internet’s 50th anniversary! On 19 May 2024, 1,000 IEEE members and other internet enthusiasts from 56 countries participated in i50: A virtual celebration of 50 years of the internet.

(40:10 + Q&A) Prof. Hiu Yung Wong, San Jose State University -- Presentation from 2023 Workshop on Quantum Computing: Devices, Cryogenic Electronics and Packaging ... Abstract: Quantum computing is ...

Produced and edited by Stephen Esker, IEEE.tv Come along with Dr. Ted Rappaport as he explores the expo hall at the Brooklyn 6G Summit, 2023!

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The discussion in this talk includes the potential new challenges, new requirements, and new opportunities for the next generation of multiple access in these new scenarios. The next generation of ...

Hosted by Sreekant Narumanchi, join us for a chat with GQ Lu and Zichen Zhang where they discuss the paper: Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With ...