Although 6-inch wafers currently dominate the SiC market, transitioning to 8-inch is an inevitable trend expected from 2026 ...

The Japanese company Resonac (formerly Showa Denko) and France-based materials company Soitec have signed an agreement to ...

Trumpf says it continues to invest heavily in its technology for higher data rates and is offering both VCSELs and photodiodes as a matching pair solution in various layouts like singlets, 1x2, 1x4, ...

Axus Technology, a provider of chemical mechanical planarisation (CMP) equipment, has announced its Capstone CS200 platform tools offer the industry’s lowest cost of ownership (CoO) for CMP processes ...

The India-US semiconductor pact – which the two leaders have described as a “watershed arrangement” – will manufacture infrared, GaN and SiC semiconductors, enabled by support from the India ...

Three companies – X-Celeprint, Ligentec, and X-FAB – are aligning their efforts to simplify and enhance photonic integrated circuit (PIC) heterogeneous integration through Micro Transfer Printing (MTP ...

The nearly €12M capital raise has also brought global semiconductor-focused investors onboard: Wafer Works from Taiwan , ...

Wolfspeed says its 2300V modules will improve system efficiency, while reducing the number of passive components. They offer ...

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Lumileds believes it is the first company to demonstrate that rich deep red light (615nm dominant wavelength corresponding ...

Ams Osram has been nominated as one of three finalists for the 'German Future Award – Federal President's Award for ...

Investing phenomenal sums in infrastructure that enables the production of SiC and GaN devices is the new norm. In this ...