Abstract: This paper presents an approach, circuit under inductor (CUI), to reduce chip area as a solution for design technology co-optimization (DTCO) in sub-10-GHz RF and millimeter-wave (mmWave) ...
This roundup covers six more IoT development kits, spanning AI-native, BLE 5.2, Wi-Fi 6, and ultra-low-power platforms.
From a single room at FAST-NU to global recognition, Pakistani engineers are quietly scripting a new chapter in silicon innovation ...
TTM Technologies' double-digit growth and industry tailwinds suggest further upside, with future revenue growth not fully ...
Abstract: The increasing integration complexity and operating frequency of modern circuit designs necessitate comprehensive electromagnetic (EM) simulations for accurate performance assessment.
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