SAN JOSE, Calif., June 24, 2009 /PRNewswire via COMTEX — Xilinx (Nasdaq: XLNX) today released the Xilinx Base Targeted Design Platform aimed at accelerating the development of system-on-chip (SoC) ...
In a couple of months Xilinx will start shipping FPGA SoCs using through-silicon-via (TSV) technology. Xilinx’s method is unique and could be called a 2.5D design, rather than 3D. The design uses an ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback