Historically, data center design was linear: Size the facility to meet demand forecasts and hope for the best. Power and ...

According to the report, the market for 3D IC and 2.5D IC packaging is projected to grow substantially from an estimated USD 58.3 billion in 2025 to approximately USD 138.0 billion by 2035, reflecting ...

Stacking dies introduces layers of complexity driven by multi-physics interactions, which must be addressed at the start of ...

Realme's upcoming GT 8 Pro is expected to arrive in India within weeks, introducing a switchable camera bump and a focus on ...

Tomorrow's horoscope guides each zodiac sign through relationship matters, job changes, and moments of reflection. The universe unfolds a celestial agenda, encouraging trust in instincts and confident ...

Frankfurt (Germany) (AFP) – German sports car maker Porsche sunk to a third-quarter loss of almost one billion euros ($1.16 billion), the firm said Friday, as it grappled with the costs returning to ...

Abstract: Achieving smaller feature sizes at a lower cost remains a critical challenge in the semiconductor industry, driven by the increasing demand for higher integration and enhanced performance.

Crypto buyers are moving quickly to secure BlockDAG (BDAG) before Batch 31, priced at $0.0015, reaches full allocation. With $430M raised, over 27 billion coins sold, and more than 312,000 holders ...

Abstract: The development of temporary bonding solutions for advanced packaging industry allowing mechanical support during backside processing, is driven by the demand for more robust and reliable ...