Several companies are racing each other to develop a new class of 2.5D and 3D packages based on various next-generation interconnect technologies. Intel, TSMC and others are exploring or developing ...
According to the report, the market for 3D IC and 2.5D IC packaging is projected to grow substantially from an estimated USD 58.3 billion in 2025 to approximately USD 138.0 billion by 2035, reflecting ...
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