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Deeptech Keysom completes a €4M fundraising and deploys th…
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Why Low-Level Libraries are the Key to AI Success
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Secure-IC unveils its Securyzr™ neo Core Platform at Embedded …
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BrainChip Identifies Advantages to Radar and Lidar Systems Leveraging Event-Based AI

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Interlaken: the ideal high-speed chip-to-chip interface
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intoPIX and BCnexxt Join Forces to Revolutionize Li…
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Fractile Licenses Andes Technology's RISC-V Vector Processor as It Builds …
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Celestial AI Acquires Rockley Photonics Patent Portfolio, Strengthening Photonic F…

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Faraday and Kiwimoore Succeed in 2.5D Packaging Pr…
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Floorplan Guidelines for Sub-Micron Technology Node for Networking Chips
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Sondrel announces Advanced Modelling Process for AI chip d…
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EnSilica - Design and Supply contract award for a controller ASIC for automotiv…

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Xylon's Updated logiHSSL IP Core Seamlessly Connects Infineon AURI…
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Semidynamics on major recruitment drive for RISC-V software engineers
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LDRA Announces Extended Support for RISC-V High Assura…
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DeepComputing and Andes Technology Partner to Develop the World's First RIS…

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Crypto Quantique teams up with Attopsemi to simplify the implementation of PUF technolog…
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CEA-Leti Launches OpenTRNG, an Open-Source Project For True Random Numbe…
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Codasip unveils versatile automotive …
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Alphawave Semi "Redefines Connectivity" in AI Hardware and Edge AI Summit 202…

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SEMIFIVE Extends Partnership with Arm to Advance AI and HPC SoC Platforms
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SiFive 加入甲辰计划，共创 RISC-V 生态繁荣
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VeriSilicon's DeWarp Processing IP DW200-FS achieved ISO 26262 A…
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Revolutionizing High-Performance Silicon: Alphawave Semi and Arm Unit…

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RISC-V Announces Ratification of the RVA23 Profile Standard
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Faraday Unveils Advanced Packaging Coordinated Platfor…
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Arteris Interconnect IP Selected by VeriSilicon for High-Performance SoC …
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Synopsys Powers World's Fastest UCIe-Based Multi-Die Designs with …

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Rambus Announces Industry-First HBM4 Controller IP to Accelerate …
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SoC Verification Flow and Methodologies
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Successful tape out of Chip Interfaces' JESD204D IP by a tier 1 semiconducto…
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Logic Fruit Technologies Welcomes Mr. Gurudutt (GD) Bansal as Senior Vice P…

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In-At-Near? The NPU Style Debate - Fairy Tale Version
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Arteris Network-on-Chip Tiling Innovation Accelerates Semiconductor Designs for AI Applications
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突破计算机视觉极限，芯原AI-ISP技术带来创新的图像增强体验

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